Related references
Note: Only part of the references are listed.Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design
Chuantong Chen et al.
JOURNAL OF ELECTRONIC MATERIALS (2017)
Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices
Chuantong Chen et al.
ACTA MATERIALIA (2017)
Self-healing of cracks in Ag joining layer for die-attachment in power devices
Chuantong Chen et al.
APPLIED PHYSICS LETTERS (2016)
Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates
Qianye Xu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C
S. T. Chua et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
K. S. Siow et al.
JOURNAL OF ELECTRONIC PACKAGING (2016)
Ageing sintered silver: Relationship between tensile behavior, mechanical properties and the nanoporous structure evolution
Pascal Gadaud et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Deformation behavior of sintered nanocrystalline silver layers
S. Zabihzadeh et al.
ACTA MATERIALIA (2015)
Influence of the Porous Microstructure on the Elastic Properties of Sintered Ag Paste as Replacement Material for Die Attachment
X. Milhet et al.
JOURNAL OF ELECTRONIC MATERIALS (2015)
In situ transmission electron microscopy and scanning transmission electron microscopy studies of sintering of Ag and Pt nanoparticles
M. A. Asoro et al.
ACTA MATERIALIA (2014)
Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates
S. A. Paknejad et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2014)
Interdiffusion and impurity diffusion in polycrystalline Mg solid solution with Al or Zn
C. C. Kammerer et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2014)
Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density
V. Caccuri et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Pressureless Bonding Using Sputtered Ag Thin Films
Chulmin Oh et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability
R. Khazaka et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Geometry and grain size effects on the forming limit of sheet metals in micro-scaled plastic deformation
Z. T. Xu et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2014)
Mechanical properties of nano-silver joints as die attach materials
Kim S. Siow
JOURNAL OF ALLOYS AND COMPOUNDS (2012)
Low-temperature low-pressure die attach with hybrid silver particle paste
K. Suganuma et al.
MICROELECTRONICS RELIABILITY (2012)
Relating Rates of Catalyst Sintering to the Disappearance of Individual Nanoparticles during Ostwald Ripening
Sivakumar R. Challa et al.
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY (2011)
State of the art of high temperature power electronics
Cyril Buttay et al.
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS (2011)
High-Temperature Lead-Free Solders: Properties and Possibilities
Katsuaki Suganuma et al.
JOM (2009)
Interfacial bonding mechanism using silver metallo-organic nanoparticles to bulk metals and observation of sintering behavior
Yusuke Akada et al.
MATERIALS TRANSACTIONS (2008)
A study of nanoparticles in Sn-Ag based lead free solders
Masazumi Amagai
MICROELECTRONICS RELIABILITY (2008)
Metal-metal bonding process using Ag metallo-organic nanoparticles
E Ide et al.
ACTA MATERIALIA (2005)
Characterisation and optimisation of innovative solders for transient liquid phase bonding and active soldering
E Lugscheider et al.
ADVANCED ENGINEERING MATERIALS (2004)