3.8 Proceedings Paper

The Morphology of Pb-free Sn-3.0Ag-0.5Cu Solder Reinforced by NiO Nanoparticles

Journal

2018 UKM FST POSTGRADUATE COLLOQUIUM
Volume 2111, Issue -, Pages -

Publisher

AMER INST PHYSICS
DOI: 10.1063/1.5111235

Keywords

SAC305; NiO Nanoparticle; Microstructure; Corrosion; Dendrite

Funding

  1. Ministry of Higher Education, Malaysia under the Fundamental Research Grant Scheme [FRGS/1/2016/STG07/UKM/02/1]

Ask authors/readers for more resources

The present study investigates the effects of NiO addition on the mechanical properties and microstructure of the Sn-3.0Ag-0.5Cu (SAC305) solder alloy. In this study, three different solder alloy were prepared by reflow soldering. SAC 305 solder alloys were doped with different percentage of Nickel oxide (NiO) nano -particles content; i.e. 0.01 wt%, 0.05 wt%, and 0.15 wt% in producing nanocomposite solder paste. Electrochemical migration of SAC305-NiO nanocomposites solder pastes was measured using water drop test. Effects of the mean-time-to-failure (MTTF) and the dendrites growth were investigated using optical microscopy.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

3.8
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available