Non-Destructive Characterization of Glass Laminated Electronics

By integrating electronics inside the laminated glass, the windows and structural glass elements can be transformed to be functional and interactive. Once the electronics is embedded into the glass in lamination process, the electronics is exposed to different type of stresses, having an influence on performance and reliability. In order to understand the consequences of lamination and to explain the reason for failures, non-destructive optical coherence tomography (OCT) based method was used in this study. In addition, thermo-mechanical simulations were done to find possible causes for observed failures in light emitting device (LED) chips and wirings. Combining the analyzed OCT data with simulations, was shown to he very effective tool to select right materials and optimize the lamination process for glass embedded electronics.