Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 47, Issue 1, Pages 9-17Publisher
SPRINGER
DOI: 10.1007/s11664-017-5722-3
Keywords
Stretchable electronics; stretchable interconnect; PDMS; Parylene; Au film
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Funding
- MSIP/KEIT of Korea [14-824-11-004]
- Basic Science Research Program of the National Research Foundation of Korea [2014R1A1A2004630]
- National Research Foundation of Korea [2014R1A1A2004630] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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Thin Au films with thickness of 150 nm could be reversibly stretched up to 30% elongation on polydimethylsiloxane (PDMS) substrate with 150-nm-thick Parylene C deposited as intermediate layer instead of a Cr adhesion layer. Prestretching of the Parylene-deposited PDMS was effective to suppress the resistance increase of Au films during their tensile elongation. While the resistance change rate Delta R/R (0) of the Au film at 30% elongation was 11 without prestretching of the Parylene-deposited PDMS, it was substantially suppressed to 0.4 with 30% prestretching of the Parylene-deposited PDMS.
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