4.6 Article

Gate Interface Engineering for Subvolt Metal Oxide Transistor Fabrication by Using Ion-Conducting Dielectric with Mn2O3 Gate Interface

Journal

ACS APPLIED ELECTRONIC MATERIALS
Volume 2, Issue 1, Pages 25-34

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsaelm.9b00641

Keywords

thin film transistor; metal oxide; sol-gel; ionic dielectric; low operating voltage

Funding

  1. Science and Engineering Research Board, India [EMR/2015/000689]
  2. IIT(BHU)
  3. Ministry of Science and Technology, Taiwan [MOST 105-2218-E-131-003, 106-2221-E-131-027, 107-2221-E-131-029 -MY2]
  4. Science and Engineering Research Board

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A solution-processed high-performance subvolt (<1 V) tin oxide (SnO2) thin film transistor (TFT) has been fabricated onto an ion conducting Li-Al2O3 gate dielectric by utilizing a high-permittivity Mn2O3 gate interface. A comparative device characterization of two different TFTs with and without a Mn2O3 gate interface with an ionic dielectric ensures that n-type Mn2O3 induces an additional electron to the semiconductor/dielectric interface trap states. Consequently, the TFT with a Mn2O3 interface achieves a lower subthreshold swing (SS) by keeping the threshold voltage closer to zero compared to the TFT without the Mn2O3 gate interface. This SnO2 TFT with Mn2O3 interface requires only 0.6 V to saturate the drain current, and device performance under such low-voltage (0.6 V) operation exhibits an-electron mobility of 17 cm(2)/V.s with on/off ratio of 3.3 x 10(4) and subthreshold swing of 124 mV/dec. This work provides a potential approach to achieve a high-performance low-voltage TFT by selecting a suitable combination of dielectric materials.

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