4.4 Article

High-Frequency Characteristics of InGaP/GaAs Double Heterojunction Bipolar Transistor Epitaxially Grown on 200 mm Ge/Si Wafers

Journal

IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
Volume 8, Issue 1, Pages 122-125

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JEDS.2020.2967406

Keywords

III-V/Si integration; bipolar transistors; semiconductor growth

Funding

  1. National Research Foundation Singapore through the Singapore MIT Alliance for Research and Technology's Low Energy Electronic Systems [IRG]

Ask authors/readers for more resources

N-p-n InGaP/GaAs double heterojunction bipolar transistor has been successfully grown on a 200 mm Ge/Si wafer using metalorganic chemical vapor deposition with low defect density of 10(7) cm (-2). Non-gold metals of Ni/Ge/Al and Ti/Al are used to form the ohmic contact for small pieces device fabrication. Both direct-current (dc) and high-frequency characteristics of the device were measured. The device with emitter area of 6 x 8 mu m(2) shows a dc gain of 55 at a collector current of I-c = 4 mA, with high collector-emitter breakdown voltage of similar to 17 V. The high-frequency response with cutoff frequency (f(T)) of 23 GHz and maximum available frequency (f(max)) of 10 GHz can be achieved. These results demonstrate that InGaP/GaAs double heterojunction bipolar transistor grown on low defect density Ge/Si wafer has the potential for realizing III-V CMOS integrated platform for high-frequency applications.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.4
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available