4.0 Article

Concurrent Removal of Heat Transfer and Mass Flow Rate Nonuniformities in Parallel Channels of Microchannel Heat Sink

Journal

Publisher

PLEIADES PUBLISHING INC
DOI: 10.1134/S004057952001011X

Keywords

microchannels; heat sink; nonuniformity; heat flux; flow maldistribution; temperature fluctuation

Funding

  1. Department of Science and Technology (DST) in India [INT/RUS/RFBR/350]
  2. Russian Foundation of Basic Research (RFBR) in Russia [18-58-45014IND_a]

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Nonuniform performance of the parallel channels of the microchannel heat sink is one of the major limitations aggravating many undesired influences in both the single phase and the two phase heat transfer in microchannel heat sink. The nonuniform performance of the channels is preliminarily governed by the nonuniformity of the mass flow rate and heat flux transferred from the interface of parallel microchannels. The poor heat transfer (adiabatic/natural convection) boundary condition is primarily responsible for heat flux nonuniformity. In the current study a novel design of parallel microchannels heat sink is proposed, which is obtained by decreasing nonuniformity of mass flow rate and heat transfer existing between parallel channels of the microchannel heat sink. The nonuniformity of the mass flow rate is removed by the existing variable width approach and heat transfer nonuniformity among parallel channels is solved by the newly developed slanted microchannel provision. Developed design normalizes flow nonuniformity by 95.5% and heat transfer nonuniformity by 97.5% in comparison to the conventional design microchannel heat sink. The two major benefits offered by the proposed design are cooled (4.2 K lower than the conventional design) and uniform (3.1 K lesser than the conventional design) base surface temperature. It is also found that proposed work even facilitated in reduction of average base temperature (1.3 K lower than the conventional design). The maximum improvement in Nusselt number is 4.07%, also the proposed design extends benefits at off-design conditions even.

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