Journal
JOURNAL OF APPLIED PHYSICS
Volume 121, Issue 21, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.4984892
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Funding
- NSF [DMR-1126894]
- JSPS KAKENHI [15H05441]
- Mitsubishi foundation [24]
- World Premier International Research Center Initiative (WPI), MEXT, Japan
- JSPS Core-to-Core Program, A. Advanced Research Networks
- Grants-in-Aid for Scientific Research [15H05441, 15H05891] Funding Source: KAKEN
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We used two novel approaches to produce sub-wavelength structure anti-reflection coatings on silicon for millimeter and sub-millimeter wave bands: picosecond laser ablation and dicing with beveled saws. We produced pyramidal structures with both techniques. The diced sample, machined on only one side, had a pitch and a height of 350 mu m and 972 mu m, respectively. The two laser ablated samples had a pitch of 180 mu m and heights of 720 mu m and 580 mu m; only one of these samples was ablated on both sides. We present measurements of shape and optical performances and comparisons to the optical performance predicted using finite element analysis and rigorous coupled wave analysis. By extending the measured performance of the one-sided diced sample to the two-sided case, we demonstrate a 25% band averaged reflectance of less than 5% over a bandwidth of 97% centered on 170 GHz. Using the two-sided laser ablation sample, we demonstrate a reflectance of less than 5% over a bandwidth of 83% centered on 346GHz. Published by AIP Publishing.
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