4.6 Article

Unexpected behavior of transient current in thin PZT films caused by grain-boundary conduction

Journal

JOURNAL OF APPLIED PHYSICS
Volume 121, Issue 22, Pages -

Publisher

AMER INST PHYSICS
DOI: 10.1063/1.4985177

Keywords

-

Funding

  1. Russian Academy of Sciences [1, 16-02-00845]
  2. Ministry of Education and Science of the Russian Federation [11.2259.2017]

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The behavior of the transient current at different preliminary polarizations has been studied in Pb(ZrTi)O-3 (PZT) films with various grain structures. To affect the grain structure, PZT films were prepared by chemical solution deposition with a two-step crystallization process using combination of seed layers with a low Pb excess and the main layers with a 30 wt. % Pb excess. Some films were prepared with a fixed Pb excess in all the deposited layers. We found that the lead excess and the seed layer crystalline structure can affect the grain-boundary conduction which, in turn, influences the polarization dependence of the transient current and the appearance of current peaks which look like the so-called negative differential resistance region in the current-voltage curves. We show that the emergence of the current peaks in the PZT films depends on (i) whether the current flows inside the ferroelectric phase (grains) or outside, along grain boundaries and (ii) whether the applied bias direction is parallel or opposite to the polarization vector. A correlation between the grain-boundary conduction and current-polarization dependences is confirmed by the local current distribution measured by conductive atomic force microscopy. Possible mechanisms responsible for specific features of the transient current and appearance of the current peaks are discussed. The effect of grain-boundary conduction on the behavior of the current may be significant and should be taken into account in ferroelectric random access memory whose readout operation assumes registration of the magnitude of the polarization switching current under positive bias. Published by AIP Publishing.

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