4.6 Article

MarsNet: Multi-Label Classification Network for Images of Various Sizes

Journal

IEEE ACCESS
Volume 8, Issue -, Pages 21832-21846

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/ACCESS.2020.2969217

Keywords

Convolutional neural networks; images of various sizes; multi-label classification; printed circuit board; solder paste inspection

Funding

  1. Industrial Strategic Technology Development Program (Machine Learning Based SMT Process Optimization System Development) - Ministry of Trade, Industry & Energy (MOTIE, Korea) [10077589]
  2. Institute for Information & Communications Technology Promotion (IITP) - Korea government (MSIT) [2016-0-00563]
  3. Korea Evaluation Institute of Industrial Technology (KEIT) [10077589] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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Since the Convolutional Neural Network (CNN) has surfaced and fascinated the world, many researchers have exploited CNN for image classification, object detection, semantic segmentation, etc. However, the conventional CNNs have a pyramidal structure and were designed to process images which have the same size. Although some CNNs can accept images of various sizes, performance is degraded for images smaller than the size of images used for training. In this paper, we propose MarsNet, a CNN based end-to-end network for multi-label classification with an ability to accept various size inputs. In order to allow the network to accept such images, dilated residual network (DRN) is modified to get higher resolution feature maps, and horizontal vertical pooling (HVP) is newly designed to efficiently aggregate positional information from the feature maps. Furthermore, multi-label scoring module and threshold estimation module are employed to serve the purpose of multi-label classification. We verify the effectiveness of the proposed network through two distinctive experiments. We first verify our model by inspecting and classifying multiple types of defects occurred in PCB screen printer using solder paste inspection (SPI) datasets. Secondly, we verify our network using VOC 2007 dataset. Our network is pioneering in that no research has attempted to accomplish multi-label classification for defects in addition to being able to take input images of various sizes in SPI field.

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