Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 696, Issue -, Pages 123-129Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2016.11.225
Keywords
Die bonding; Micron silver paste; Ag2O additive; Lowtemperature; Sintering; Pressureless
Categories
Funding
- COI Stream Project
- China Scholarship Council
- [24226017]
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Silver sintering joining technology provides lead-free die attachment with excellent thermal conductivity and compatibility with high-temperature (>= 300 degrees C) applications. However, sintering affordable micron-scale silver particles requires high temperature and the assistance of high pressures, which can damage chips and increase the manufacturing cost. In this article, we achieved the low-temperature, pressureless sintering of micron-scale silver particles by employing an active Ag2O additive as a bridge among the micron-scale silver particles. The Ag2O was reduced in situ to nanoscale silver to activate the surface of the micron-scale silver particles, resulting in the rapid diffusion and densification of silver particles at low temperature. An optimized composition of Ag-10% Ag2O exhibited a bonding strength of over 40 MPa at only 180 degrees C without any additional pressure. The results suggest that affordable micronscale metal particles can be sintered using a suitable activating additive under an energy-efficient and eco-friendly fabrication process. (C) 2016 Elsevier B.V. All rights reserved.
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