Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 709, Issue -, Pages 329-336Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2017.03.162
Keywords
SiCp/Al-20Si composite; Microstructure; High pressure solidification; Ageing treatment; Thermal conductivity
Categories
Funding
- National Natural Science Foundation of China [51601110, 51601109, 51375294, 51402189]
- China Postdoctoral Science Foundation [2016M601563]
- Natural Science Foundation of Shanghai [17ZR1440800, 14ZR1418800]
- Youth Teacher Development Program of Shanghai Universities [ZZGCD15100, ZZGCD15036]
- connotation construction project of Shanghai University of Engineering Science [nhxk-16-07]
- German Science Foundation (DFG) under Leibniz Program [EC 111/26-1]
- European Research Council under ERC Advanced Grant INTELHYB [ERC-2013-ADG-340025]
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As an advanced electronic packaging material, SiCp/Al-20Si composites have been fabricated by high pressure solidification. The mechanism of formation of fibrous eutectic Si and the thermal conductivity (TC) behavior of the composites have been systematically investigated. High pressure decreases diffusion of Si phase significantly; moreover, SiC addition hinders the diffusion and provides nucleation sites for the Si phase. Both high pressure and SiC contribute to the formation of fibrous eutectic Si. The SiCp/Al-20Si composite solidified at 3 GPa exhibits lowest TC due to the formation of a supersaturated Al(Si) solid solution, whereas it is highest after ageing treatment. The optimal TC of the 45% SiCp/Al-20Si composite is 166.8 W/m.K at room temperature. The TC of the composites can be well predicted by the Hasselman-Johnson (H-J)theoretical model. (C) 2017 Elsevier B.V. All rights reserved.
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