3.8 Proceedings Paper

Optimization of process parameter of diffusion bonding of Ti -Al and Ti -Cu

Journal

MATERIALS TODAY-PROCEEDINGS
Volume 27, Issue -, Pages 1689-1695

Publisher

ELSEVIER
DOI: 10.1016/j.matpr.2020.03.577

Keywords

Titanium alloy; Scanning electron microscope (SEM); Micro hardness tester; Diffusion bonding; Hard press

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Titanium Alloy are renowned in the field of aircraft, automobile, spacecraft and highly rated electronics because of their property such as toughness, corrosion resistance, tensile strength and lightweight. In this research paper, the effect of several heat treatments on the microstructure and micro hardness of Ti Alloy using the scanning electron microscope and diffusion bonding. Diffusion Bonding is a process of joining similar and dissimilar metals below the melting Point at the surface by maintaining bonding time, bond- ing pressure and Temperature. The characterization of bonding can be evaluated by conducting micro hardness test and microstructural Analysis. The process parameter involved in diffusion bonding can be optimized for better band strength and atomic transfer at the interface. Analysis can be done through SEM and micro hardness test result. Suitability of the coatings on the base metal for various engineering applications by knowing optimum thickness of coatings and relevant techniques for coatings and coat- ings material. With the wear test, it is possible to analyse the rate of wear and variation of the wear rate w.r.t to operating conditions. Finally, it was found that the titanium alloy can be very much useful in the place of materials which are prone to corrosion and can be used in biomedicines due to its properties due to some of its chemical properties and it can withstand extreme wear and tear. Different material com- bination can be used for diffusion bonding using hard press with inert atmosphere. ? 2019 Elsevier Ltd. All rights reserved. Selection and peer -review under responsibility of the scientific committee of the First International conference on Advanced Lightweight Materials and Structures.

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