4.5 Article

Strain-enhanced highQ-factor GaN micro-electromechanical resonator

Journal

SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
Volume 21, Issue 1, Pages 515-523

Publisher

TAYLOR & FRANCIS LTD
DOI: 10.1080/14686996.2020.1792257

Keywords

GaN; MEMS resonator; stress; lattice mismatch

Funding

  1. JST-PRESTO [JPMJPR19I7]
  2. JSPS KAKENHI [JP18K14141]
  3. National Key Research and Development Program of China [2018YFE0125700]
  4. World Premier International Research Center (WPI) initiative on Materials Nanoarchitectonics (MANA), Ministry of Education, Culture, Sports, Science & Technology (MEXT) in Japan

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We report on a highly sensitive gallium nitride (GaN) micro-electromechanical (MEMS) resonator with a record quality factor (Q) exceeding 10(5)at the high resonant frequency (f) of 911 kHz by the strain engineering for the GaN-on-Si structure. Thefof the double-clamped GaN beam bridge is increased from 139 to 911 kHz when the tensile stress is increased to 640 MPa. Although it is usually regarded that the energy dissipation increases with increasing resonant frequency, an ultra-highQ-factor which is more than two orders of magnitude higher than those of the other reported GaN-based MEMS is obtained. The highQ-factor results from the large tensile stress which can be intentionally introduced and engineered in the GaN epitaxial layer by utilizing the lattice mismatch between GaN and Si, leading to the stored elastic energy and drastically decreasing the energy dissipation. The developed GaN MEMS is further demonstrated as a highly sensitive mass sensor with a resolution of 10(-12) g/s through detecting the microdroplet evaporation process. This work provides an avenue to improve thef x Qproduct of the MEMS through an internally strained structure.

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