Journal
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume 94, Issue 5-8, Pages 2343-2355Publisher
SPRINGER LONDON LTD
DOI: 10.1007/s00170-017-1021-7
Keywords
Diamond turning; Silicon; Tool geometry; Tool wear; Chip formation
Funding
- EPSRC [EP/K018345/1]
- Strathclyde University Impact Acceleration Account [120526/RA9029]
- Royal Society-NSFC international exchange programme [IE141422]
- EPSRC [EP/K018345/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/K018345/1] Funding Source: researchfish
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This paper presents an investigation of the effect of tool rake angle in single point diamond turning (SPDT) of silicon using experimental and simulation methods. Machining trials under the same cutting conditions were carried out using three different rake angle tools. In order to delve further into the rake angle effect on the output parameters including material removal, stresses and crack formation, at the onset of chip formation and steady-state conditions, a simulation study using smoothed particle hydrodynamics (SPH) approach was performed. The simulation results were incorporated and found in good agreement with experimental observations. The results indicate that diamond tool wear rate and surface generation mechanism significantly vary using different rake angle tools. The continuance of compressive and shear deformation sequence at the chip incipient stage governs the high-pressure phase transformation (HPPT) as a function of rake angle and tool wear. The capability of diamond tool to maintain this sequence and required hydrostatic pressure under worn conditions is highly influenced by a change in rake angle. The proportional relationship of cutting force magnitude and tool wear also differs owing to disparate wear pattern which influence distribution of stresses and uniform hydrostatic pressure under the tool cutting edge. This subsequently influences structural phase transformation and therefore frictional resistance to cutting. Mainly frictional groove wear was found dominant for all diamond tools in machining of silicon.
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