Journal
INTERMETALLICS
Volume 91, Issue -, Pages 50-64Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.intermet.2017.08.002
Keywords
Intermetallics; Anisotropy; Joining (soldering); Interfaces; Diffraction (X-ray); Electron backscatter diffraction
Categories
Funding
- Nihon Superior Co., Ltd.
- UK EPSRC [EP/M002241/1]
- Australian synchrotron beamtimes [AS132/PD/5784, AS141/PD/7413]
- EPSRC [EP/M002241/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/M002241/1] Funding Source: researchfish
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The directional coefficient of thermal expansion (CTE) of intermetallics in electronic interconnections is a key thermophysical property that is required for microstructure-level modelling of solder joint reliability. Here, CTE ellipsoids are measured for key solder intermetallics using synchrotron x-ray diffraction (XRD). The role of the crystal structure used for refinement on the CTE shape and temperature dependence is investigated. The results are used to discuss the beta Sn-IMC orientation relationships (ORs) that minimise the in-plane CTE mismatch on IMC growth facets, which are measured with electron backscatter diffraction (EBSD) in solder joints on Cu and Ni substrates. The CTE mismatch in fully-intermetallic joints is discussed, and the relationship between the directional CTE of monoclinic and hexagonal polymorphs of Cu6Sn5 is explored.
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