Journal
JOURNAL OF POLYMER SCIENCE
Volume 58, Issue 23, Pages 3358-3369Publisher
WILEY
DOI: 10.1002/pol.20200628
Keywords
dual cross‐ linking networks; photopolymerization; pressure‐ sensitive adhesives; rheological properties; viscoelasticity
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Funding
- Ministry of Science and ICT (MSIT), Republic of Korea [KK1953-20]
- Ministry of Trade, Industry and Energy (MOTIE), Republic of Korea [10053627]
- Korea Evaluation Institute of Industrial Technology (KEIT) [10053627] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- National Research Council of Science & Technology (NST), Republic of Korea [KK1953-20] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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Pressure-sensitive adhesives (PSAs) demand the ability to simultaneously improve toughness and adhesion. However, these requirements of PSAs have remained a great challenge because robust and recoverable characteristics are usually contradictory properties of PSAs. Dual cross-linking networks developed by incorporating dynamic noncovalent bonds into chemical cross-linking networks have the potential to mitigate these requirements in a wide variety of applications including adhesives, hydrogels, and elastomers. Herein, a facile approach to achieve dual cross-linking networks of acrylic PSAs with excellent mechanical properties and high-adhesive performance that integrate physically cross-linked networks into chemically cross-linked networks is proposed. Diurethane acrylic monomer-pentaerythritol ethoxylate (DAM-PEEL) groups were introduced into the acrylic PSA system through photopolymerization. The PSA/DAM-PEEL dual cross-linking networks led to the development of the chemically cross-linked networks for both PSA and DAM via covalent bonds and the physically cross-linked networks between the amide groups of DAM and the hydroxyl groups of PEEL via hydrogen bonds. Consequently, the PSA/DAM-PEEL dual cross-linking networks were able to simultaneously improve the modulus and stretchability. This design strategy for developing dual cross-linking networks of materials could offer potential applications for various adhesive-related applications.
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