Journal
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume 65, Issue 7, Pages 2373-2386Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TMTT.2017.2660491
Keywords
Chip-to-chip; dielectric waveguide; leaky wave antenna (LWA); power coupler; substrate integrated waveguide (SIW); sub-mmWave; traveling wave
Categories
Funding
- Office of Naval Research [N00014-15-1-2429, N00014-16-1-2322]
- MIT Lincoln Laboratory Military Fellows Program
- MIT Center for Integrated Circuits and Systems
- Analog Device Inc.
Ask authors/readers for more resources
A new type of broadband link enabling extremely high-speed chip-to-chip communication is presented. The link is composed of fully integrated sub-mmWave on-chip traveling wave power couplers and a low-cost planar dielectric waveguide. This structure is based on a differentially driven half-mode substrate integrated waveguide supporting the first higher order hybrid microstrip mode. The cross-sectional width of the coupler structure is tapered in the direction of wave propagation to increase the coupling efficiency and maintain a large coupling bandwidth while minimizing its on-die size. A rectangular dielectric waveguide, constructed from Rogers Corporation R3006 material, is codesigned with the on-chip coupler structure to minimize coupling loss. The coupling structure achieves an average insertion loss of 4.8 dB from 220 to 270 GHz, with end-to-end link measurements presented. This system provides a packaging-friendly, cost effective, and high performance planar integration solution for ultrabroadband chip-to-chip communication utilizing millimeter waves.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available