Journal
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION
Volume 24, Issue 6, Pages 3794-3800Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDEI.2017.006609
Keywords
Micro-silica; nano-silica; epoxy-modified silicone; epoxy/micro-/nano-silica composite (EMNC); electrical insulation breakdown strength
Funding
- Convergence Technology Program of the Small & Medium Business Administration (SMBA), Korea
- Regional Innovation Center (RIC) program of the Ministry of Trade, Industry and Energy (MOTIE), Korea
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The surface of micro-silica and nano-silica was modified with epoxy-modified silicone and their effect on the electrical breakdown strength was evaluated in epoxy/micro/nano-silica composites (EMNCs). Firstly, the surface of micro- and nano-silica was treated with hydroxyl silane and then the hydroxyl group of the silane was reacted with epoxy-modified silicone. The surface-treated micro-and nano-silicas were mixed with epoxy resin and polyester-modified polydimethylsiloxane (PEM-PDMS) by using an ultrasonicator. Transmission electron microscope (TEM) was used to observe the even dispersion of nano-silica in an epoxy/micro-silica composite and it was found that the nano-silicas were well dispersed. The electrical breakdown strength of the epoxy/microsilica (60 wt%)/nano-silica (1 phr)/PEM-PDMS (0.5 phr) system was 60.0 kV /2 mm, which was 13.6% higher than that of epoxy/micro-silica (60 wt%)/PEM-PDMS (0.5 phr) system, 52.8 kV / 2 mm. The contact angle of neat epoxy was 77 degrees, which was 132% higher than that of epoxy/micro-silica (60 wt%)/nano-silica (1 phr)/PEM-PDMS (0.5 phr) system, 101.6 degrees.
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