Journal
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION
Volume 24, Issue 2, Pages 784-790Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDEI.2017.006299
Keywords
Polymeric composites; hyperbranched polyborosilazane; boron nitride; dielectric property; thermal conductivity
Funding
- National Natural Science Foundation of China [21174112, 51403175]
- Shaanxi Natural Science Foundation of Shaanxi Province [2015JM5153]
- Foundation of Aeronautics Science Fund [2015ZF53071, 2015ZF53074]
- Seed Foundation of Innovation and Creation for Graduate Students in NPU [Z2016166]
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In this paper, we presented a new strategy for fabrication of polymeric composites combined with low dielectric loss and desirable thermal conductivity. With the incorporation of hyperbranched polyborosilazane (hb-PBSZ) into bisphenol A cyanate ester (BADCy) matrix, the modified hb-PBSZ/BADCy resin with 4 wt% hb-PBSZ possessed a low dielectric constant ((a) over dot) value of 2.37 and relatively low dielectric loss tangent value of 0.008 at 1MHz. Furthermore, by integrating micrometer boron nitride particles (mBN) into hb-PBSZ/BADCy matrix, the mBN/hb-PBSZ/BADCy composites presented relatively low (a) over dot of 3.09, desirable thermally conductive coefficient (lambda of 0.63 W/(m center dot K)) and thermal diffusivity (a of 0.42 mm(2)/s) values. It provides an important perspective for designing dielectric and thermally conductive polymeric composites for electrical packaging and energy storage fields.
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