Journal
INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH
Volume 59, Issue 47, Pages 20701-20710Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acs.iecr.0c03133
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Funding
- Natural Science Foundation of Liaoning Province [2019-MS-256]
- Aeronautical Science Foundation of China [2018ZF54036]
- Postdoctoral Science Foundation of China [2019 M651151]
- National Natural Science Foundation of China [51973123]
- plan of rejuvenating the Talents of Liaoning Province [XLYC1907135]
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Due to the rapid development of modern micro/nano electronic devices, polymer nanocomposites of high mechanical performance, and thermal conductivity and stability are increasingly important. We herein report a two-step process for preparation of similar to 3 nm-thick boron nitride (BN) nanosheets through noncovalent modification by a surfactant Triton X-100, which improves the compatibility of the nanosheets with the matrix as well as their dispersion. TEM micrographs demonstrated that the modified BN nanosheets (m-BN) were relatively uniformly dispersed in epoxy matrix and some were connected with each other. At 2.14 vol % of m-BN, the glass-transition temperature (T-g) and adhesive toughness of neat epoxy were improved by 17% and 355%, respectively. At 4.93 vol %, the thermal conductivity of neat epoxy was remarkably increased to 0.65 W.m(-1).k(-1), an increment of 335%. In addition, the epoxy/m-BN nanocomposites exhibited high thermal stability, which holds a potential as thermal interface materials for the next generation of electronic devices.
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