Journal
IEEE ELECTRON DEVICE LETTERS
Volume 38, Issue 12, Pages 1720-1723Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2017.2765340
Keywords
GaN-on-Si; vertical p-n diodes; drift layer; on-resistance; breakdown voltage; power electronics
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Funding
- Japan Science and Technology Agency
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This letter reports on the epitaxial growth and device fabrication of metal-organic chemical vapor deposition grown fully vertical GaN-on-Si p-n diodes. A strong dependence in the electrical characteristics and epitaxial growth of n(-)-GaN drift layer was revealed by analyzing the threading dislocations, and carrier properties of the drift layers and current-voltage characteristics of the fabricated p-n diodes. Further, our GaN-on-Si vertical p-n diode with a 2.3-mu m-thick n(-)-GaN drift layer exhibited an on-resistance of 7.7 m Omega.cm(2), a turn-on voltage of 3.4 V, and a breakdown voltage of 369 V, respectively.
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