Journal
IEEE ELECTRON DEVICE LETTERS
Volume 38, Issue 1, Pages 44-47Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2016.2633490
Keywords
High-k-metal-gate; CMOS; embedded non-volatile memory
Categories
Funding
- DARPA [FA 8650-16-C-7648]
- Global-Foundries
Ask authors/readers for more resources
The availability of on-chip non-volatile memory for advanced high-k-metal-gate CMOS technology nodes has been limited due to integration and scaling challenges as well as operational voltage incompatibilities, while its need continues to grow rapidly in modern high-performance systems. By exploiting intrinsic device self-heatingenhancedcharge trapping in as fabricated highk- metal-gate logic devices, we introduce a unique multipletime programmable embedded non-volatile memory element, called the 'charge trap transistor' (CTT), for high-k-metal-gateCMOS technologies. Functionality and feasibility of using CTT memory devices have been demonstrated on 22 nm planar and 14 nm FinFET technology platforms, including fully functional product prototype memory arrays. These transistor memory devices offer high density (similar to 0.144 mu m(2)/bit for 22 nm and similar to 0.082 mu m(2)/bit for 14 nm technology), logic voltage compatible and low peak power operation (similar to 4mW), and excellent retention for a fully integrated and scalable embedded non-volatile memory without added process complexity or masks.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available