4.6 Article

A Highly Linear Temperature Sensor Using GaN-on-SiC Heterojunction Diode for High Power Applications

Journal

IEEE ELECTRON DEVICE LETTERS
Volume 38, Issue 8, Pages 1105-1108

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2017.2714865

Keywords

Gallium nitride; heterojunction diode; silicon carbide; temperature sensor

Funding

  1. Department of Energy [DE-SC0016485]
  2. State Key Laboratory of Alternate Electrical Power System
  3. Renewable Energy Sources [LAPS17021]
  4. U.S. Department of Energy (DOE) [DE-SC0016485] Funding Source: U.S. Department of Energy (DOE)

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Silicon carbide (SiC) power devices have been commercialized up to 1.7 kV with operating temperatures up to 573 K. The temperature limitations of SiC devices are generally derived from limitations in packaging and a lack of information on safe operating temperature regimes. Therefore, it is highly desirable to develop reliable temperature sensing techniques that can better take advantageof the SiC devices in high power applications. In this letter, ten gallium nitride (GaN)-on-SiC heterojunction diodes, aiming at highpower and high-temperaturesensing applications, were fabricated using concentric ring geometry. These sensors can be monolithically integrated into GaN-on-SiC RF/Microwave power devices with fast-switching frequency and highpower density. The temperature dependent characteristics of the forward voltage drop at fixed current (VD-T) of these heterojunction devices and their sensitivities (mV/K) are comprehensively characterized in a temperature range from 300 to 650 K. These devices exhibit a high degree of linearity in their VD-T characteristics, which indicates the potential to be used as temperature sensors up to 650 K.

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