Journal
IEEE ELECTRON DEVICE LETTERS
Volume 38, Issue 7, Pages 890-893Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2017.2707279
Keywords
a-IGZO TFTs; strain; flexible; tensile; compressive
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Funding
- Ministry of Trade, Industry and Energy/Korea Display Research Corporation [10052044]
- Korea Evaluation Institute of Industrial Technology (KEIT) [10052044] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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We report the changes in device performance of flexible amorphous indium-gallium-zinc-oxide thin-film transistors (TFTs) by 1.65% tensile or compressive bending stress for 10 k times. The TFTs exhibit negative threshold voltage (Delta V-Th) shift and enhanced drain current (I-D). TFT performance under repetitive tensile bending stress exhibits comparatively large threshold voltage shift (Delta V-Th = -2.3 V) than compressive bending stress (Delta V-Th = -0.9 V), which might be originated from both the generation of interface states (N-int) and gap trap density (dN(gap)/dE) by 3.5 x 10(11)/cm(2) and 5.7 x 10(12)/cm(2) eV, respectively under tensile bending stress. These are much higher than those (N-int: 1.2 x 10(11)/cm(2) and dN(gap)/dE: 2.2 x 10(12)/cm(2)eV) for compressive bending. The increase in the DOS appears after both types of the bending stress which is related to the generation of oxygen vacancies. According to technology computer aided design simulation, the 10 k times repetitive compressive bending stress generates donor like states (Delta N-GD) similar to 2 x 10(16) cm(-3) and tensile bending stress generates Delta N-GD similar to 9.5 x 10(16) cm(-3) at similar to E-C -0.35 eV.
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