A Novel Design of Temporary Bond Debond Adhesive Technology for Wafer-Level Assembly

Heterogeneous integration gained significant momentum in the semiconductor industry as it compliments lithographic scaling and offers alternative pathways to device improvement. Temporary bond debond technology (TBDB) with a glass carrier provides a manufacturing platform for this heterogeneous assembly on the wafer level. This paper describes the material development of a silicone-based temporary adhesive to enable robust bonding of the device wafer to glass carrier, as well as a thermoset polymer based laser release layer that enables stress-free glass debond upon receiving UV irradiation. We found that thermoset based temporary bond adhesive offers robust thermal stability, low outgassing, and excellent mechanical stability, making it suitable for wafer level assembly with a temporary glass carrier. An innovative, solvent-based cleaning solution was also identified to efficiently break down the crosslinked adhesive network, offering a robust wafer cleaning process, post laser debonding at room temperature. Some preliminary results of heterogeneous wafer level assembly using this novel temporary adhesive with laser debond will also be discussed.