Journal
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)
Volume -, Issue -, Pages 2209-2214Publisher
IEEE COMPUTER SOC
DOI: 10.1109/ECTC32862.2020.00344
Keywords
silicon photonics; optical transceiver; 100 Gbps PAM-4
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Funding
- Taiwan Ministry of Science and Technology [MOST 208-2218-E-992-302]
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A 16-channel optical transmitter module that integrates a silicon photonics chip with Mach-Zehnder modulators (MZMs), a V-groove with single-mode fiber (SMF), micro lens, O-band high-power distributed feedback laser diodes (DFB LDs), and the temperature controller has been proposed and demonstrated. To prove the feasibility of the module design, the optical coupling calculation, the thermal effect, and high-speed signal integrity are analyzed and characterized. The coupling efficiency of optical system is around 45%. The operation temperature of the module can be separately controlled at 30 degrees C and 35 degrees C for the silicon photonics chip and DFB LDs by thermal simulation. The 3-dB bandwidth is excess of 40 GHz which allows the module to operate at 50 GBaud signal quality by four-level pulse amplitude modulation (PAM-4). The hybrid assembly technique and modularized solution can meet high-density and high-speed I/O interconnection packaging requirements for silicon photonics device development and also can be applied in the next-generation optical transceivers for high-speed data centers and cloud networks.
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