Journal
2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)
Volume -, Issue -, Pages -Publisher
IEEE
DOI: 10.1109/estc48849.2020.9229855
Keywords
SLID; Intermetallics; High Pressure; Ultrasound; Piezoelectric
Funding
- Research Council of Norway [245963/F50, 237887]
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This paper investigates the influence of high pressure on Au-Sn solid-liquid interdiffusion (SLID) bonds formed by bonding Si substrates to dies of either lead-zirconate titanate (PZT) with high surface roughness or Si with low surface roughness. Bonded samples were exposed to 1000 bar pressure in a silicone oil filled pressure vessel. Samples were characterized before and after exposure by means of scanning acoustic microscopy, optical microscopy and scanning electron microscopy with energy dispersive x-ray spectroscopy. All but one sample successfully passed the pressure exposure. This failed sample had a delamination in the proximity of a large void in the intermetallic layer.
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