Journal
JOURNAL OF APPLIED POLYMER SCIENCE
Volume 138, Issue 17, Pages -Publisher
WILEY
DOI: 10.1002/app.50276
Keywords
coatings; films; kinetics; surfaces and interfaces
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Polymer metallization is achieved by incorporating small amounts of metal-organic compounds in the molten polymers, allowing for successful electroless copper deposition initiation. The influence of bath parameters and activator nature are investigated, demonstrating the feasibility of using cheaper Ni or Cu instead of expensive Pd.
Polymer metallization is important for several applications but triggering of electroless deposition is problematic. A simple and inexpensive method to prepare the polymers for initiating the electroless copper deposition is successfully applied to Liquid Crystal Polymer and Polyethylene Terephthalate. The samples are prepared by incorporation of a small amount (<0.5 wt%) of metal-organic compounds (palladium, nickel, or copper acetates) in the molten polymers. During blending, the polymers are held at sufficiently high temperatures to thermally decompose the acetates, yielding the metallic particles (Pd, Ni, or Cu) which are used as the activators. After surface preparation, copper is deposited on polymers in an electroless bath including formaldehyde as reducer. The influence of bath parameters (temperature, composition) and the nature of activators is investigated. This method can be extended to other polymers by finding an appropriate polymer/metal-organic couple. It is also demonstrated that cheaper Ni or Cu can substitute expensive Pd.
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