Journal
APPLIED PHYSICS EXPRESS
Volume 14, Issue 1, Pages -Publisher
IOP PUBLISHING LTD
Keywords
GaN; transmission electron microscopy; crystallographic defects; power device
Categories
Funding
- MEXT Program for research and development of next-generation semiconductor to realize energy-saving society [JPJ005357]
- Polish National Science Centre [2018/29/B/ST5/00338]
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Investigation into defect time-evolution in Mg ion-implanted GaN revealed that annealing at 1573 K for an unprecedentedly long duration resulted in a significant reduction in defects inhibiting Mg activation. Additionally, the cathodoluminescence intensity of donor-acceptor pair originating from Mg acceptors increased with duration, indicating the potential to lower annealing temperature by prolonging duration. These findings suggest practical annealing technology for Mg ion-implanted GaN.
Defect time-evolution was investigated in Mg ion-implanted GaN after annealing at 1573 K for an unprecedentedly long duration. Transmission electron microscopy directly revealed that annealing for over 30 min reduced defects inhibiting Mg activation, just like annealing at 1753 K for a short duration. The cathodoluminescence intensity of donor-acceptor pair originating from Mg acceptors increased as the duration increased, and the intensity after annealing for 60 min was higher than after short-duration annealing at 1753 K. These show the potential of lowering the annealing temperature by prolonging the duration, which would lead to practical annealing technology for Mg ion-implanted GaN.
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