Journal
CORROSION SCIENCE
Volume 99, Issue -, Pages 313-319Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.corsci.2015.07.026
Keywords
Alloy; Tin; SEM; Cathodic protection; High temperature corrosion
Funding
- Pro Progressio foundation (Hungary)
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The effect of current load was investigated on corrosion induced tin whisker growth from SnAgCu (SAC) solder alloys. Three alloys were studied: two low Ag content micro-alloyed SAC and the widely used SAC305. The solder joints were loaded with six different DC current levels between 0 and 1.5A and they were aged in corrosive environment (85 degrees C/85RH%) for 3000h. The morphology of the whiskers and the micro-structural changes of the solder joints were examined by scanning electron microscope. It was shown that the current load can decrease the corrosion of the solder joints and consequentially it can decrease whiskering as well. (C) 2015 Elsevier Ltd. All rights reserved.
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