3.8 Proceedings Paper

A study on thermal conductivity enhancement of silicon carbide filler glass fiber epoxy resin hybrid composites

Journal

MATERIALS TODAY-PROCEEDINGS
Volume 35, Issue -, Pages 330-334

Publisher

ELSEVIER
DOI: 10.1016/j.matpr.2020.02.008

Keywords

Error analysis; Lees apparatus; Glass fiber hybrid polymer composites; Thermal conductivity

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The silicon carbide filler glass fiber reinforced polymer composites were prepared using a hand-lay-up technique and compression molding machine. Experimental results show that the thermal conductivity of the hybrid polymer composite increases with an increase in silicon carbide percentage. Comparison between experimental results and mathematical models revealed small differences at low silicon content percentages, with the Maxwell model showing a difference of 10.40%, Rule of mixtures 16.12%, and Hashin formula 3.62% for 20% SiC content.
The silicon carbide filler glass fiber reinforced polymer composites have been prepared by using hand-lay- up technique compression molding machine. Thermal conductivity of silicon carbide filler glass fiber reinforced polymer composites at different volume fractions of glass fiber and silicon carbide is determined using Lee's apparatus experimentally. The experimental results show that the thermal conductivity of the hybrid polymer composite increases with increase in silicon carbide percentage. Experimental results are compared with mathematical models Hashin formula, Maxwell model and Rule of mixture model to find the variation of the thermal conductivity with volume fraction of silicon carbide. All three mathematical models exhibited results close to each other at low percentage silicon content. From mathematical models and experimental results the difference between the two has been found to be small for 20% SiC content; for example, Maxwell model showed a difference 10.40%, Rule of mixtures 16.12% and Hashin formula 3.62% for 20% SiC content. (C) 2019 Elsevier Ltd. All rights reserved.

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