Journal
MATERIALIA
Volume 15, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.mtla.2020.100967
Keywords
Solid-state additive manufacturing; Microstructure evolution; Geometric dynamic recrystallization; Discontinuous recrystallization; Texture; Misorientation
Categories
Funding
- National Science Foundation [CMMI-1853893]
- Virginia Tech National Center for Earth and Environmental Nanotechnology Infrastructure (NanoEarth)-a member of the National Nanotechnology Coordinated Infrastructure (NNCI) - NSF [ECCS 1542100, ECCS 2025151]
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The study investigates the process-microstructure linkages in additive friction stir deposition using aluminum-magnesium-silicon alloy and copper, showing that the microstructure in aluminum-magnesium-silicon evolves primarily through continuous dynamic recrystallization, while copper exhibits heterogeneous microstructure due to discontinuous recrystallization. The differences in microstructure evolution are attributed to intrinsic thermomechanical properties and interactions with the tool head.
Among metal additive manufacturing technologies, additive friction stir deposition stands out for its ability to create freeform and fully-dense structures without melting and solidification. Here, we employ a comparative approach to investigate the process-microstructure linkages in additive friction stir deposition, utilizing two materials with distinct thermomechanical behavior-an Al-Mg-Si alloy and Cu-both of which are challenging to print using beam-based additive processes. The deposited Al-Mg-Si is shown to exhibit a relatively homogeneous microstructure with extensive subgrain formation and a strong shear texture, whereas the deposited Cu is characterized by a wide distribution of grain sizes and a weaker shear texture. We show evidence that the microstructure in Al-Mg-Si primarily evolves by continuous dynamic recrystallization, including geometric dynamic recrystallization and progressive lattice rotation, while the heterogeneous microstructure of Cu results from discontinuous recrystallization during both deposition and cooling. In Al-Mg-Si, the continuous recrystallization progresses with an increase of the applied strain, which correlates with the ratio between the tool rotation rate Oand travel velocity V. Conversely, the microstructure evolution in Cu is found to be less dependent on O, instead varying more with changes to V. This difference originates from the absence of Cu rotation in the deposition zone, which reduces the influence of tool rotation on strain development. We attribute the distinct process-microstructure linkages and the underlying mechanisms between Al-Mg-Si and Cu to their differences in intrinsic thermomechanical properties and interactions with the tool head.
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