Dynamic covalent chemistry for architecture changing interpenetrated and single networks

Interpenetrating networks (IPN) comprise two or more networks which are woven but not covalently bonded to each other. This is in contrast to simple, or single Networks (SN), which contain only one network that is covalently crosslinked. This study develops SNs and IPNs using 2-hydroxyethyl acrylate as the monomer and (2-((1-(2-(acryloyloxy)ethyl)-2,5-dioxopyrrolidin-3-yl) thio)ethyl acrylate) (TMMDA) as a thermoresponsive dynamic thiol-Michael crosslinker. In the case of the IPN and SN materials the TMMDA is used as a thermoresponsive linker in each network, since TMMDA undergoes dynamic covalent exchange above 90 degrees C. In this way the SN and IPNs are kinetically trapped in their as synthesized structures until exposed to thermal stimulus. The focus of this study is to investigate how dynamic bond exchange can modulate material properties, after the material has been synthesized using the SN and IPN materials as model systems. The dynamic nature of the thiol-Michael crosslinker allows the transition of IPNs into SN like structures above 90 degrees C resulting in similar polymer architecture in both SN and IPN. Surprisingly, upon heating the SN materials also changed their mechanical properties, upon activation of the dynamic thiol-Michael bonds. This enhancement is proposed to occur by thermally activating the thiol-Michael bonds and reducing the number of floppy loops at higher temperature.

Automated summary

The study investigates the properties of SN and IPN materials constructed using 2-hydroxyethyl acrylate and TMMDA, as well as how dynamic bond exchange can modulate material properties, revealing that the dynamic thiol-Michael bonds can impact changes in material structure and performance.