4.3 Article

Hybrid fabrication of LED matrix display on multilayer flexible printed circuit board

Journal

FLEXIBLE AND PRINTED ELECTRONICS
Volume 6, Issue 2, Pages -

Publisher

IOP PUBLISHING LTD
DOI: 10.1088/2058-8585/abf5c7

Keywords

hybrid fabrication; flexible electronics; roll-to-roll (R2R); printed electronics; hybrid electronics; printed circuit boards (PCBs)

Funding

  1. Ministry of Trade, Industry and Energy (MOTIE), Korea [20006408]
  2. National Research Foundation of Korea (NRF) - Korean government (MSIT) [2020R1A5A1019649]
  3. principle research R&D program of the Korea Institute of Machinery and Materials [NK230E]
  4. Korea Evaluation Institute of Industrial Technology (KEIT) [20006408] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
  5. National Research Council of Science & Technology (NST), Republic of Korea [NK230E] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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This study introduces a hybrid fabrication process for LED matrix on flexible multilayer printed circuit boards, utilizing roll-to-roll screen printing to create a core circuit board. By laminating and etching processes, the core PCB is transformed into four layers in total, enabling the implementation of passive LED matrix display. This method can be applied to other applications requiring flexible and multilayer circuits.
This study presents a hybrid fabrication process for LED matrix on flexible multilayer printed circuit boards (PCBs). To prepare for the flexible PCB, a roll-to-roll screen printing process was developed to create a core circuit board by printing on both sides of the flexible substrate. From the core PCB, the lamination and etching processes are then used to form four layers in total. By using the proposed method, we successfully implemented the passive LED matrix display. This approach could be used for other applications that require flexible and multilayer circuits.

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