Journal
MATERIALS TODAY-PROCEEDINGS
Volume 44, Issue -, Pages 2435-2441Publisher
ELSEVIER
DOI: 10.1016/j.matpr.2020.12.487
Keywords
Flat feet; 3D printing; Orthotic devices; Fallen arch
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Flat foot has become a major health issue globally, affecting people worldwide. The main reasons include sedentary lifestyle and lack of exercise. Doctors recommend treatments such as physical activities and using orthotic aids to alleviate the problem.
Foot pain, mainly flat foot, has been a major health issue of people all over the globe. It has been attributed to their sedentary lifestyle as compared to the past. Prime reasons for foot pain to occur even among normally arched individual are zero exercise, putting on excessive weight, prolonged sitting and standing etc. People in the age group of 60?65 years face the effect of flat foot. It is observed that even people from the middle age group of 40?60 years are also developing this issue because of their lifestyle. People from the age groups lesser than these are also developing flat foot issues in the recent times. Doctors have suggested treatments like performing physical activities, consuming medicines and using orthotic aids to control the problem. Orthotic aids commonly suggested are insoles, cushions, massage pads, medical shoes etc. Utilization of orthotic aids provides relaxation to the foot. Silicon material is typically used for making orthotic aids through injection molding process. However, it is also reported that there is lack of comfort while using these devices. To resolve this issue, an attempt is made to provide an alternative to the traditionally manufactured orthotic aids. Prime focus has been on designing and developing a 3D printed orthotic aid that improves lower limb alignment of foot and also promotes relief to the various foot pain issues. This comprises achieving an optimized design through analysis and manufacturing using 3D printing. ? 2021 Elsevier Ltd. All rights reserved. Selection and peer-review under responsibility of the scientific committee of the International Conference on Materials, Processing & Characterization.
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