4.4 Article

Sub-Pico-Second Hole Generation Lifetime in Thin Film IGZO Sputtered and Annealed on P-Silicon Substrate

Journal

IEEE TRANSACTIONS ON NANOTECHNOLOGY
Volume 20, Issue -, Pages 392-399

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TNANO.2021.3077538

Keywords

Indium gallium zinc oxide (IGZO); minority carrier generation lifetime

Funding

  1. DST, (Nano-mission) Govt. of India [DST/NM/NT/2018/103 (G)]

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In this study, the hole thermal generation lifetime of IGZO was extracted using a biased depleted HfO2/IGZO thin film MOS capacitor. The transition from amorphous to nano-crystalline state in IGZO thin film with increased annealing temperature resulted in differences in lifetime, which was validated through morphological analysis and XRD, SEM, and AFM measurements. The accuracy of the measured hole generation lifetime was indirectly demonstrated through surface generation velocities and energy distributions measurements.
Indium-gallium-zinc-oxide (IGZO) sputtered and annealed in the absence of oxygen shows large oxygen vacancy concentration leading to n-type doping of the thin film. However, because of low intrinsic carrier concentration minority carrier (hole) concentration remains weak. Thus, measurement of thermal hole generation lifetime in unipolar IGZO is challenging. In this work, utilizing the charge transient of an appropriately biased depleted HfO2/IGZO thin film MOS capacitor fabricated on a p-silicon substrate, we extracted hole thermal generation lifetime of IGZO. The measured lifetime was found between 0.62-0.064 ps whence IGZO film received 400 degrees C to 700 degrees C anneal treatments followed by its direct sputtering on p-silicon substrate. Further, a morphology analysis of the IGZO was presented. Difference in the lifetime which occurred due to amorphous to the nano-crystalline transition of the IGZOthin film with increased anneal temperature was furthermore validated through XRD, SEM and AFM measurements. Hole capture cross-sections as we obtained from surface generation velocities at the IGZO/HfO2 interface and energy distributions of interface state density were found in agreement, which indirectly demonstrates the accuracy of the measured hole generation lifetime employing the transient capacitance extrapolation, since under the steady state condition hole generation through the interface states of IGZO/HfO2 tends to balance its bulk (IGZO) counterpart

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