4.1 Article

On the Design of the World's Smallest Flow Sensor Package

Journal

IEEE SENSORS LETTERS
Volume 5, Issue 6, Pages -

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LSENS.2021.3077959

Keywords

Sensor packaging; flow control; flow sensor; MEMS; micromachining; packaging

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By investigating novel lid designs, the sensitivity and repeatability of the miniature flow sensing system were increased while minimizing the negative impact of vortices. This led to improved predictability and stability of the sensors, enabling high-sensitivity, large-range, low-cost production for mass-market applications.
In this letter, a miniature flow sensing system has been designed, simulated, manufactured, and tested. The system is comprised of a thermal flow sensing die, a package body, a lid, and leveling epoxy. The lid design is crucial to the system performance, and a reference design was shown to create vortices within the flow channel, resulting in nonlinear and nonrepeatable sensor response. Two novel lid designs were investigated that showed increased sensitivity and repeatability, while minimizing the effect of vortices disrupting the sensor response. These structures were named vortex guides. The first design provided a double increase in the signal sensitivity, while the second design isolated the vortices away from the sensors functional area, providing predictable flow response over a wider flow range. This enables high-sensitivity, large-range, low-cost miniature flow sensing for mass-market production.

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