3.9 Article

Infrared thermometer on the wall (iThermowall): An open source and 3-D print infrared thermometer for fever screening

Journal

HARDWAREX
Volume 9, Issue -, Pages -

Publisher

ELSEVIER
DOI: 10.1016/j.ohx.2020.e00168

Keywords

Thermometer; Infrared; Fever screening; Open-source; 3-D print

Funding

  1. Research Grant PUTI Q1 2020 from Directorate Research and Development Universitas Indonesia [NKB-1418/UN2.RST/HKP.05.00/2020]
  2. Research Grant PDUPT 2020 Penelitian Dasar Unggulan Perguruan Tinggi from the Ministry of Research Republic of Indonesia
  3. Community Grant IbM 2020 IPTEKS bagi Masyarakat from the Community Service and Empowerment Universitas Indonesia

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In this study, an infrared thermometer on the wall (iThermowall) was introduced for fever screening in public areas without an operator. Temperature measurement validation of the iThermowall was conducted using T-test analysis, showing similar performance to a reference thermometer. The study provides open-source 3-D printable firmware for developing and under-resourced communities.
In this COVID-19 pandemic, a non-contact handheld infrared thermometer is frequently used for fever screening. However, the handheld thermometer performance depends on the operator and the distance to the forehead. To address these problems, we present an infrared thermometer on the wall (iThermowall). The iThermowall is a low-cost non-contact thermometer, adapted for the use of fever screening in public areas without an operator. The hardware can measure human body temperature automatically when the distance between the sensor and forehead is adequate. Temperature measurement validation of the iThermowall was conducted by T-test analysis. The results show that the P-values for all the test is more significant than 0.05, means that the mean Celsius temperature for both groups (reference thermometer and iThermowall) are similar. This article provides the 3-D printable open-source and the full source code firmware for the developing and under-resourced communities. (C) 2021 The Authors. Published by Elsevier Ltd.

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