In situ fabrication of silver/polyimide composite films with enhanced heat dissipation

In this study, silver/polyimide (Ag/PI) composite films with enhanced heat dissipation properties were prepared. Ag was formed in situ by reducing AgNO3 at various locations according to the reduction method. Two different types of soluble PIs capable of solution processing were used, namely Matrimid and hydroxy polyimide (HPI). Unlike Matrimid with bulky substituents, HPI with polar hydroxy groups formed ion-dipole interactions with Ag ions to form Ag particles with uniform size distribution. The location and distribution of Ag particles affect the heat emission characteristics of the composite films, resulting in better heat dissipation properties with the thermally and photochemically reduced Ag/HPI films having more Ag particles distributed inside of the films than the chemically reduced films.

Automated summary

Silver/polyimide (Ag/PI) composite films with enhanced heat dissipation properties were prepared in this study. Ag particles were formed in various locations by reducing AgNO3, and two types of soluble polyimides, Matrimid and HPI, were utilized. The interaction between HPI and Ag ions led to uniform size distribution of Ag particles, affecting heat emission characteristics and improving heat dissipation properties of the composite films.