Journal
CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES
Volume 128, Issue 2, Pages 639-668Publisher
TECH SCIENCE PRESS
DOI: 10.32604/cmes.2021.016159
Keywords
Pb-free; hysteresis; ratcheting; fatigue; tangent modulus
Funding
- Ministry of Science and Technology, ROC [MOST 107-2221-E-006-138, MOST 109-2221-E-006-008 MY2]
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An implicit integration scheme was developed for simulating the viscoplastic constitutive behavior of Sn3.0Ag0.5Cu solder and implemented into the finite element software ANSYS. The numerical procedure was used to study the responses of solder joints in an electronic assembly under temperature cycling conditions. Viscoplastic strain energy density accumulation over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the solder joints.
An implicit integration scheme was developed for simulating the viscoplastic constitutive behavior of Sn3.0Ag0.5Cu solder and programmed into a user material subroutine of the finite element software ANSYS. The numerical procedure first solves the essential state variables by using a three-level iterative procedure, and updates the remaining stress and state variables accordingly. The numerical implementation was applied to consider the responses of solder joints in an electronic assembly under temperature cycling condition. The viscoplastic strain energy density accumulation over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the solder joints.
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