Journal
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
Volume 9, Issue -, Pages 814-819Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JEDS.2021.3111866
Keywords
Amorphous InGaZnO (a-IGZO); thin-film transistor (TFT); high-k dielectric; Ti incorporation
Categories
Funding
- Natural Science Foundation of Top Talent of SZTU [2019010801007]
- National Key Research and Development Program of China [2016YFA0401103]
- Shenzhen Science and Technology Project [JCYJ20200109144012410]
Ask authors/readers for more resources
Incorporation of an appropriate amount of Ti in the La2O3 gate dielectric significantly improves the electrical characteristics of amorphous InGaZnO thin-film transistors, while excessive Ti incorporation leads to device degradation.
The effects of Ti incorporation in La2O3 gate dielectric on the electrical characteristics of amorphous InGaZnO thin-film transistor are studied. Compared to the control sample with La2O3 gate dielectric, the device performance can be significantly improved with an appropriate Ti dose. Accordingly, the sample with a Ti/(Ti+La) ratio of 6.7% presents a high saturation mobility of 28.1 cm(2)V(-1)s(-1), small subthreshold slope of 0.17 V/dec, large on/off current ratio of 7.2x10(7), and acceptable hysteresis. We attribute such an improvement to the passivation of the defect states at/near the La2O3/InGaZnO interface as well as the enhancement of moisture resistance of La2O3 film due to Ti incorporation. However, excessive Ti incorporation leads to device degradation, which is due to more oxygen vacancies generated in gate dielectric.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available