3.8 Proceedings Paper

High-speed germanium p-i-n avalanche photodetectors on silicon

Publisher

SPIE-INT SOC OPTICAL ENGINEERING
DOI: 10.1117/12.2588981

Keywords

silicon photonics; complementary metal-oxide semiconductor technology; optical photodetectors; pin mode operation; avalanche mode operation; germanium; impact ionization; gain; gain-bandwidth product; high-speed links

Funding

  1. Slovak Research and Development Agency [PP-COVID-20-0100]

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Integrated silicon nanophotonics has shown significant progress in various applications such as optoelectronics and communication technologies. Germanium-based photodetectors offer high performance and low cost, making them suitable for next-generation on-chip interconnections and high-speed optical interconnects.
Integrated silicon nanophotonics has progressed a lot over past decades with great promises for many surging applications in optoelectronics, information and communication technologies, sensing or health monitoring. Enabling low-cost, dense integration, and compatibility with modern semiconductor nanofabrication processes, silicon nanophotonics deliver compact and high-performance devices on single chips. A variety of nanophotonic functionalities, both passive and active, are nowadays available on semiconductor substrates, leveraging the maturity of open-access silicon foundries and epitaxial germanium integration. It encompasses essential functions such as light generation and amplification, fast electro-optical modulation, and reliable conversion of optical into electrical signals. Germanium-based optical photodetectors are main building blocks within the library of integrated silicon nanophotonics, with performances that are nowadays on par with their III-V-based counterparts. Germanium photodetectors integrated at the end of waveguides are attractive for next-generation on-chip interconnections, because of their compactness, bandwidth and speed, energy consumption and cost. In this work, we present our latest advances on silicon-germanium p-i-n waveguide-integrated photodetectors based on lateral silicon-germanium-silicon heterojunctions. Our hetero-structured photodetectors were fabricated on top of 200-mm silicon-on-insulator substrates using industrial-scale fabrication processes compatible with complementary metal-oxide-semiconductor technology. Silicon-germanium p-i-n photodetectors operated under low bias voltages exhibited low dark-currents (similar to 100 nA), cut-off frequencies beyond 50 GHz, and photo-responsivities of about 1.2 A/W. Photodetector sensitivities of -14 dBm and -11 dBm were achieved for communication data rates of 10 Gbps and 25 Gbps, respectively. P-i-n photodetectors with lateral heterojunction operated in an avalanche regime offered an additional degree of freedom to improve device performances. High-speed and low-noise characteristics were obtained in our p-i-n photodetectors upon avalanche operation, with a gain-bandwidth product of 210 GHz and a low carrier impact ionization ratio of about 0.25. The measured sensitivity of avalanche-operated devices was -11 dBm for 40 Gbps signal detection. As demonstrated in the reported achievements, hetero-structured p-i-n photodetectors are thus suitable communication devices in future intra-data center links or high-speed optical interconnects.

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