Journal
2021 21ST INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS)
Volume -, Issue -, Pages 242-245Publisher
IEEE
DOI: 10.1109/TRANSDUCERS50396.2021.9495414
Keywords
MEMS microphone; high performance; signal-to-noise-ratio (SNR); squeeze-film damping; noise
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This paper presents the development of a conventional constrained-diaphragm capacitive MEMS microphone that achieves superior performance compared to other MEMS microphones on the market. By minimizing MEMS acoustic damping losses through finite-element analysis (FEA), the microphone was able to improve its signal-to-noise ratio (SNR). The simple architecture and use of standard silicon-based processes for MEMS fabrication led to successful optimization, resulting in a 73dBA SNR and -34dBV/Pa sensitivity, with a strong correlation between simulated and measured frequency response and noise spectrum.
This paper reports on the development of a conventional constrained-diaphragm capacitive MEMS microphone that outperforms the highest performing MEMS microphones available in the market today. The design concept is to minimize MEMS acoustic damping losses to improve the signal-to-noise-ratio (SNR) using the finite-element analysis (FEA) to study the effect of different MEMS parameters on damping. The architecture is very simple and standard silicon-based processes are used for MEMS fabrication. With optimization, 73dBA SNR and -34dBV/Pa sensitivity has been achieved and very good correlation between simulated and measured frequency response and noise spectrum has been demonstrated.
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