4.6 Article

Surface plasmon coupling regulated CsPbBr3 perovskite lasers in a metal-insulator-semiconductor structure

Journal

RSC ADVANCES
Volume 11, Issue 59, Pages 37218-37224

Publisher

ROYAL SOC CHEMISTRY
DOI: 10.1039/d1ra06828h

Keywords

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Funding

  1. National Key Research and Development Program of China [2017YFB0403101]
  2. National Nature Science Foundation of China [62074077, 61921005, 61904068, 61974062]
  3. Leading-edge Technology Program of Jiangsu Natural Science Foundation [BK20202005]
  4. Solid-State Lighting and Energy-Saving Electronics Collaborative Innovation Center
  5. Natural Science Fund of Colleges and Universities in Jiangsu Province [20KJB140024]

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Researchers have successfully constructed an Ag/SiO2/CsPbBr3 hybrid structure based on surface plasmons, achieving significant enhancement of CsPbBr3 radiative recombination efficiencies and further verifying the effectiveness of optimizing the thickness of the SiO2 layer.
A strong coupling effect often occurs between a metal and semiconductor, so micro/nano-lasers based on surface plasmons can break through the optical diffraction limit and realize unprecedented linear and nonlinear enhancement of optical processes. Hence, metal-insulator-semiconductor (M-I-S) structures based on perovskite materials were explored to design optoelectronic devices. Herein, we constructed an Ag/SiO2/CsPbBr3 hybrid structure to generate surface plasmon coupled emission between the metal and CsPbBr3 perovskite. Combined with experimental characterization and COMSOL Multiphysics software simulations, the best enhancement for CsPbBr3 radiative recombination efficiencies can be achieved with a 10 nm-thickness of the SiO2 layer and 80 nm-thickness of the Ag metal film, further verified by optimizing the thickness of the SiO2 layer above the Ag metal film. In this state, the laser threshold can be as low as 0.138 mu W with a quality (Q) factor of up to 3907 under optical pumping, which demonstrate a significant step toward practical applications in biological technology, chemical identification, and optical interconnections of information transmission.

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