Protocol on the fabrication of monocrystalline thin semiconductor via crack-assisted layer exfoliation technique for photoelectrochemical water-splitting

Thin semiconductors attract huge interest due to their cost-effective, flexible, lightweight, and semi-transparent properties. Here, we present a protocol on the preparation of thin semiconductor via controlled crack-assisted layer exfoli-ation technique. The protocol details the fabrication procedure for producing thin monocrystalline semiconductors with thicknesses in the range of a few tens of micrometers from thick donor substrates. In addition, we describe proof-of-concept application of the thin semiconductors for photoelectrochem-ical water-splitting to produce hydrogen fuel.For complete details on the use and execution of this protocol, please refer to Lee et al. (2021).

Automated summary

This article presents a protocol for preparing thin semiconductors and describes their application in photoelectrochemical water-splitting for hydrogen fuel production.