4.6 Article

Engineering the surface morphology of inkjet printed Ag by controlling solvent evaporation during plasma conversion of AgNO3 inks

Journal

JOURNAL OF MATERIALS CHEMISTRY C
Volume 10, Issue 13, Pages 5257-5265

Publisher

ROYAL SOC CHEMISTRY
DOI: 10.1039/d1tc06174g

Keywords

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Funding

  1. National Science Foundation (NSF) [CMMI-1246715]
  2. United States Department of Veterans Affairs Rehabilitation Research and Development Service [IK2 RX001841]

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This study demonstrates that the surface morphology of silver structures prepared from particle-free inks can be controlled by solvent evaporation effects. The surface roughness and porosity of the silver films depend on the vapor pressure of the ink solvent, increasing with decreasing vapor pressure. Using inkjet printing, rough and porous metal films were fabricated for hydrogen peroxide sensors, with sensitivity increasing with surface roughness and porosity, which are related to the vapor pressure of the solvent.
In this paper, we show that the surface morphology of silver (Ag) structures prepared by plasma conversion of particle-free inks can be controlled by solvent evaporation effcts. A series of three ethylene-glycol-based solvents were used to systematically vary the vapor pressure of the ink. Following inkjet printing, films were converted by exposure to a low-pressure, low-temperature radio-frequency (RF) plasma. Scanning electron microscopy (SEM) and profilometry of the Ag films showed that the surface roughness and porosity depend on the vapor pressure of the ink solvent, with each increasing with decreasing vapor pressure. As a result of changes to the porosity, electrical resistivity increased as the solvent vapor pressure decreased. To demonstrate the utility of a printing technique for rough and porous metal films, we fabricated Ag-based hydrogen peroxide (H2O2) sensors using inks comprised of the three ethylene-glycol-based solvents. The sensitivity of these sensors was found to increase with the surface roughness and porosity, which in turn, was related to the vapor pressure of the solvent.

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