Experimental and numerical investigation on the heat transfer enhancement for Mini-channel heat sinks with tessellated fins

Thermal management continues to be a constructive procedure applied to extend the life span in electronic equipment. In this paper, a novel mini-channel heat sink with tessellated fins is proposed with different arrangements of oblique channels width and slant angle of secondary channels and the heat cooling capacity of the mini-channel heat sink is investigated numerically and experimentally at the Reynolds number (Re) in the range of 573 to 2295. The results indicated that the new mini-channel heat sink with tessellated fins is more conductive to strengthen the heat transfer effect. The simulation results show that with the increase of volume flow rate, the temperature difference and pressure drop of the model bottom plate with tessellated fins decrease obviously. When the oblique channel slant angle is 70and the inclined flow channel width is 1.8 mm, the heat transfer effect of better quality can be achieved basically. By processing the single-objective and multi-objective genetic algorithm optimization, optimal designs is predicted and analyzed based on the two variables associated to the geometry of the channels. It is found that the optimized model promotes better thermal performance and uniform substrate temperature, i.e., the pressure drop can be reduced by up to 73%, the average Nusselt number can be raised by up to 17%, and the minimal temperature difference of 17 K at Q(v) = 30 ml/s. To the end, the error calculation proves that the multi-objective optimization results are in good agreement with the simulation results.

Automated summary

This paper proposes a novel mini-channel heat sink with tessellated fins and investigates its heat cooling capacity numerically and experimentally. The results show that the new design is more conductive to heat transfer and optimized designs can further improve thermal performance and uniform substrate temperature.