Journal
MATERIALS & DESIGN
Volume 99, Issue -, Pages 543-551Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2016.03.101
Keywords
Transient liquid phase bonding (TLP); Ti-6Al-4V; AISI 304; Microstructure; bonding temperature
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Transient liquid phase (UP) bonding process was performed to join Ti-6Al-4V and AISI 304 austenitic stainless steel using a copper interlayer. The effect of the bonding temperature on the microstructure and mechanical properties was studied in the range of 870-960 degrees C. Microstructural characterization was carried out through optical microscopy, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). The results showed that the rate of isothermal solidification was increased by increasing the bonding temperature. In addition, when the bonding temperature was increased to 960 degrees C, the width of the eutectic and intermetallic zones was completely removed, leading to complete isothermal solidification. According to the results, a minimum hardness value of 216 VHN was measured in the joint zones and the highest shear strength was 374 MPa, as obtained for the sample joined at 960 degrees C. The fracture analysis showed different fracture morphologies for different bonding temperatures. (C) 2016 Elsevier Ltd. All rights reserved.
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