Journal
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
Volume 4, Issue 1, Pages 1-6Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JEDS.2015.2503701
Keywords
High-electron mobility transistor (HEMT); fin-shaped field-effect transistor (FinFET); Gallium nitride; short channel
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Through implementation of the 3-D tri-gate topology, GaN-based high-electron mobility transistors (HEMTs) have been fabricated and high-frequency performances as well as the short-channel effects are investigated. The designed tri-gate transistors are highly-scaled having 100 nm of gate length, which introduces the condition of a short channel. It is demonstrated that higher sub-threshold slopes, reduced drain-induced barrier lowering and better overall off-state performances have been achieved by the nano-channel tri-gate HEMTs with an AlGaN barrier. A lattice-matched InAlGaN barrier with the help of the fin-shaped nano-channels provide improved gate control, increasing current densities, and transconductance g(m). In a direct comparison, very high drain current densities (similar to 3.8 A/mm) and g(m) (similar to 550 mS/mm) have further been obtained by employing a pure AlN barrier.
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